Thermally conductive materials are used more and more frequently in communications, home appliances, automobiles and handheld mobile devices. As people pursue integration and miniaturization, high-power and highly integrated electronic chips and equipment terminals have increasingly stringent heat dissipation requirements in working conditions. Power devices, especially products with higher integration levels, have increasingly stringent requirements during their working processes. The heat generated by work is particularly obvious. At this time, it is necessary to use thermal conductive materials or thermal devices to conduct the heat out as quickly or uniformly as possible, so that the internal power devices can operate normally in a relatively low temperature environment, thus greatly extending the Regarding the mission life and safety of the device, thermal conductive materials mainly refer to gap-filling surface contact materials and space-filling materials.

Thermal conductive adhesive is mainly used for gap filling and bonding between high-performance chips, high-power transistors, thermistors, temperature sensors, and power supplies and other high-power electrical modules and radiators (copper, aluminum). The advantage is that it can be removed The traditional connection method of cards and screws also brings more reliable filling and heat dissipation, simpler process, and more economical cost.

The function of thermally conductive potting glue is to pott and protect components with high heat dissipation requirements. Thermal conductive potting silicone rubber can obtain different thermal conductivity by adding different thermal conductors. Ordinary ones can reach 0.6-2.0, and those with high thermal conductivity can reach 0.6-2.0. 4.0 or above

Thermal pads fill the air gap between the heating device and the heat sink or metal base. They have good elasticity and self-adhesiveness. They do not require adhesive and can be covered on the surface of irregular devices. In addition, the pads are easy to cut. Can be cut into the desired shape as needed

Thermal conductive gel, also known as thermal conductive gel or thermal conductive mud, is a gel-like thermal conductive material made of silicon as the base material and composite thermal conductive filler. It has the advantages of thermal conductive pads and thermal conductive silicone grease and has strong plasticity, making up for the two. Its shortcomings are its affinity, weather resistance, high and low temperature resistance and excellent insulation. It can meet the needs of uneven interfaces and thermal conductive filling. It can be widely used in LED, communication equipment, mobile phone equipment, memory modules, IGBT, semiconductors and automobiles. Electronics and other fields