HGS6100 series thermal conductive potting glue is a low viscosity flame retardant two-component addition type organic potting glue.
This product does not produce any by-products during the curing reaction and is used in potting of LED lighting equipment, power drive modules, etc. Plays the role of thermal conductivity, insulation, moisture-proof and flame retardant
Material certificate
| TYPE | HGS6110 | HGS6120 | HGS6130 | HGS6140 | HGS6150 | Guideline |
|---|---|---|---|---|---|---|
| Component | A:B | A:B | A:B | A:B | A:B | — |
| Weight specific gravity | 1:1 | 1:1 | 1:1 | 1:1 | 1:1 | — |
| Viscosity cps | 4500±300 | 4800±300 | 4800±300 | 4800±300 | 4850±300 | GB/T 2794-1995 |
| Viscosity after mixing cps | 4500±300 | 4800±300 | 4800±300 | 4800±300 | 4850±300 | GB/T 2794-1995 |
| Operational time min | 90~120 | 90~120 | 90~120 | 90~120 | 90~120 | Actual test of usage environment |
| Full cure time（hr） | 8±2 | 8±2 | 8±2 | 8±2 | 8±2 | Actual test of usage environment |
| Curing time min 80℃ | 30±5 | 30±5 | 30±5 | 30±5 | 30±5 | Actual test of usage environment |
| hardness（Shore A） | 60±5 | 55±5 | 60±5 | 60±5 | 50±5 | ASTM D2240 |
| Volume resistivity（.com） | ≥1×1016 | ≥1×1016 | ≥1×1016 | ≥1×1016 | ≥1×1016 | ASTM D247 |
| Dielectric strength（kV/mm） | ≥27 | ≥27 | ≥27 | ≥27 | ≥27 | ASTM D150 |
| Dielectric constant（1MHz） | 3.0~3.3 | 3.0~3.3 | 3.0~3.3 | 3.0~3.3 | 3.0~3.3 | ASTM D150 |
| Thermal conductivity [W/(m.K)] | ≥0.6 | ≥0.8 | ≥1.0 | ≥1.5 | ≥1.8 | ASTM D5470 |
| Fire-proof level | UL 94-V0 | UL 94-V0 | UL 94-V0 | UL 94-V0 | UL 94-V0 | — |
