HC600E Thermal Pad is an ultra conformable, thermally conductive, silicone gap pad filler, ideal for filling air gaps in high voltage devices.
A pre-cured and electrically insulating material with a “gel-like” modulus that provides shock absorbing and low stress vibration dampening characteristics. This product is recommended for applications that require isolation between heat sinks and high-voltage, bare-leaded devices.
Detailed Information
To request a sample of our Thermal Pads or inquire about more product information, please email us at yinnxian224@gmail.com
Product Description
The SHEEN’s SF Series Silicone Thermal Pads are renowned for their distinctive characteristics, which include:
◆ Good thermal conductivity, with options ranging from 1.5 to 12.0 W/m·K.
◆ Available in various thicknesses from 0.15 to 10.0 mm.
◆ Highly compressible, soft, reducing assembly stress and protecting sensitive and fragile components.
◆ Self-adhesive for easy application and rework.
◆ Customizable die-cut shapes to meet specific customer needs.
◆ Exceptional tensile strength and abrasion resistance.
◆ Excellent electrical insulation properties.
◆ Superior flame resistance, achieving a UL94 V-0 rating.
◆ Low silicone oil bleed and low siloxane volatility, minimizing impact on equipment.
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.
◆ Good thermal conductivity, with options ranging from 1.5 to 12.0 W/m·K.
◆ Available in various thicknesses from 0.15 to 10.0 mm.
◆ Highly compressible, soft, reducing assembly stress and protecting sensitive and fragile components.
◆ Self-adhesive for easy application and rework.
◆ Customizable die-cut shapes to meet specific customer needs.
◆ Exceptional tensile strength and abrasion resistance.
◆ Excellent electrical insulation properties.
◆ Superior flame resistance, achieving a UL94 V-0 rating.
◆ Low silicone oil bleed and low siloxane volatility, minimizing impact on equipment.
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.
Applications
Mechanical hard disk
Power battery
Lighting equipment
Chip Application
PCB board
Removable storage device
Wireless communication equipment
Radiator Application
Properties
| Properties | Thermal Conductivity | Thickness | Applicable temperature | Hardness | Breakdown Voitage | Thermal Impedance (1mm,@30psi) | Dielectric constant (1MHz) |
|---|---|---|---|---|---|---|---|
| Unit | W/m·K | mm | ℃ | Shore 00 | KV/mm | ℃*in2/W | 1MHz |
| HC100E | 1.0 | 0.3~10.0 | -40~200 | 30 ~ 90 | ≥4 | 0.90 | 5.5 |
| HC200E | 2.0 | 0.3~10.0 | -40~200 | 30 ~ 90 | ≥4 | 0.80 | 5.5 |
| HC300E | 3.0 | 0.3~10.0 | -40~200 | 30 ~ 90 | ≥4 | 0.70 | 5.5 |
| HC400E | 4.0 | 0.3~10.0 | -40~200 | 30 ~ 90 | ≥4 | 0.50 | 5.5 |
| HC500E | 5.0 | 0.3~10.0 | -40~200 | 30 ~ 90 | ≥4 | 0.42 | 5.5 |
| HC600E | 6.0 | 0.5~10.0 | -40~200 | 30 ~ 90 | ≥4 | 0.31 | 5.5 |
| HC700E | 7.0 | 0.5~10.0 | -40~200 | 30 ~ 90 | ≥4 | 0.23 | 5.5 |
| HC800E | 8.0 | 0.5~10.0 | -40~200 | 30 ~ 90 | ≥4 | 0.19 | 5.5 |
| HC1000E | 10.0 | 0.5~10.0 | -40~200 | 30 ~ 90 | ≥4 | 0.12 | 5.5 |
| HC1200E | 12.0 | 0.5~10.0 | -40~200 | 30 ~ 90 | ≥4 | 0.10 | 5.5 |
About
Shenzhen Kuayue Electronics Co.,Ltd.
Founded in 2007, it is a high-tech enterprise specializing in the research and development, manufacturing and sales of thermal conductive materials.
